產品名稱 產品描述 連結 附註
產品訊息

合晶科技作為世界級半導體矽晶圓供應商,致力於提供全球顧客高品質的產品與服務,產品包括各種摻質12吋(含以下)的拋光晶圓、磊晶晶圓、雙拋晶圓、研磨晶圓、蝕刻晶圓、超薄晶圓及SOI晶圓,並針對不同應用的元件特性,以自身的材料專業及由長晶至磊晶的整合技術,為客戶提供最適當的產品與服務,滿足客戶現在與未來的需求。

https://www.waferworks.com/tw/products-and-service/service

拋光矽晶圓

合晶科技晶圓產品佈局完整,應用領域包含積體電路與分離器件所需的各類輕摻、重摻晶圓,摻質包括硼、磷、砷、銻以及特殊用途的多元素共摻雜(co-doping)產品。

Lightly-doped Polished (Take 8-inch 100 Crystal Orientation as an Example)

Category
Key Indicator
(Take >0.12µm COP as an Example)
Other Indicator
Standard Prime30-100 particles/wafer
Crystal orientation, oxygen content, RRG, ORG, BMD, DZ, flatness, crystal edge/ backside treatment can be customized
Low COP/Advanced Low COP
10-30 particles/wafer
NPC (Nearly Perfect Crystal)
< 10 particles/wafer
Ultra-high Resistivity
--(Except above) Res. > 1,000Ω-cm

Highly-doped Polished (Take 8-inch 100 Crystal Orientation as an Example)

DopantKey Indicator
(Take Resistivity as an Example)
Other Indicator
Boron> 0.6mΩ-cm
Crystal orientation, oxygen content, RRG, ORG, BMD, DZ, flatness, edge andbackside treatment can be customized.
Phosphorus> 0.9mΩ-cm
Arsenic> 1.8mΩ-cm
Antimony> 9.0mΩ-cm
Multi-element co-doping
--
(Except above, co-doping can also include nitrogen and germanium)

https://www.waferworks.com/tw/polished-silicon-wafers

磊晶矽晶圓

除拋光矽晶圓外,合晶科技亦提供高品質磊晶矽晶圓代工,滿足客戶對不同元件的需求,提供one-stop-shopping的服務。

https://www.waferworks.com/tw/epitaxial-wafers

SOI晶圓

合晶科技除了拋光晶圓與磊晶晶圓外,亦將開發多年的晶圓鍵合與相關技術,搭配自主生產的各類晶圓,製作成8吋與6吋的SOI (Silicon-On-Insulator)晶圓,鎖定微機電元件、光學元件、類比元件等應用領域,以高度彈性的自主技術與材料,提供客戶所需SOI晶圓,主要產品分類如下表。

CategoryImportant Characteristic
Main Application
ADSOIThickness of device layer/ uniformity of device layer
Microelectromechanical optical and analog device
Multi-layers SOI

 

https://www.waferworks.com/tw/soi-wafers

客製化晶圓

半導體晶圓除了常見的拋光晶圓、磊晶晶圓與SOI晶圓外,合晶科技也以自主生產的各種矽單晶棒,搭配適當的晶圓加工技術,提供客戶雙拋晶圓、研磨晶圓、蝕刻晶圓、超薄晶圓等特殊要求的各類產品,滿足客戶各類半導體元件的用途。

https://www.waferworks.com/tw/custom-wafers